Frequently Asked Questions
This is entirely dependant on usage. The recommended approach is to keep a record of usage in your lab book in order to make predictions of future target life span.
Although the operational vacuum is achievable using the standard plastic vacuum hose it may take many hours pumping to achieve it. We therefore recommend using the stainless steel vacuum hose kit (part no. 13711) when the system is used to coat platinum. Even with the stainless steel hose, pump-down time is still dependent on the cleanliness of the system and it may still take in excess of 1 hour to achieve the lower operational vacuum necessary for coating platinum.
Using air for sputtering is acceptable for Au coating however argon would give a slightly better sputter rate for the same conditions. For sputtering anything other than Au and Au/Pd, argon is vital to prevent oxidation and improve sputter rate.
The degree to which the carbon rod has been sharpened affects the deposition rate. The thinner the end point, the faster the deposition rate.
The crystal usage value shown on the display is a little misleading since it shows the frequency range of the crystal oscillator circuit, rather than the usable range. It is suggested that the crystal be replaced when it reaches 30% used.
A 4 inch wafer stage and gearbox is offered for the Q150 (Pt 10458), and 4 inch is considered the largest practical wafer for the Q150 Plus.
A coater can operate quite well with a coated glass chamber but it is very difficult to diagnose problems unless the plasma can be observed. The coating in the chamber may also make it difficult to obtain low chamber pressures, due to absorbed moisture which will take time to pump away.
No, there are crucial parameters that should only be accessed by a quorum engineer.
Tooling factor can be different for different sputter targets due to changes in sputter gas pressures which will change the 'scattering' characteristics.
The maximum size of the pump motor will be limited by the switching capacity of the pump relay in the coater, the maximum being about 2kW. However neither the pumping speed or ultimate vacuum pressure are unlikely to be improved beyond that of the pump provided with the instrument.
There can be three reasons why low pressure cannot be reached. One is the measurement of the vacuum, the second is the condition of the vacuum pump, the third is possibility of a leak. Make sure that the vacuum chamber is clean, and that the chamber seals are in good condition. Have the coater serviced.
Yes you can, provided you change the FTM settings for the deposition material, thus there will be a shortening of the FTM crystal life span, so it should be replaced at about 20%
There must be a temperature gradient between the CO2 cylinder and the chamber of the CPD, if the CPD is the same temperature or warmer than the CO2 cylinder then you will not have liquid in the CPD. Also, make sure you have a LIQUID WITHDRAW cylinder. Not a standard CO2 cylinder. Check the cylinder is not almost empty.
There is a range of stage options for the Q series coaters, and these are detailed on the sale brochures. Please contact [email protected] for price and availability.
Yes you can but it was not really designed to be used in this way, some parameters will need to be changed in the software to allow this process. If an ambient loading chamber is required, we recommend the PP3004 'QuickLok'.
Carbon does not sputter well in a DC 'magnetron' sputter coater. To sputter carbon you would need an RF sputter coater, but evaporation of carbon in the Quorum instruments is quite easy.
There can be a number of reasons for continued charging of the sample in the SEM. It may be that the sputter target is completely used, so rather than sputtering, Au or Pt for instance, the area where the plasma is concentrated is just the aluminium backing plate. The aluminium will not sputter without much higher sputtering power.
No. While anything is 'possible', in practical terms the amount of work required would make this un-economical.
Yes you can. There will be a suitable BNC socket in the base plate of the chamber, and all of the electronics and software is present to support this.
When gold, or any metal for that matter, is sputtered onto a SEM sample, the ideal thickness will be in the order of 5-15nm. With this thickness the coating is not thick enough to appear 'metallic'. It is not until the coating reaches about 30nm that it will take on a metallic appearance, but at this thickness it will be masking detail on the sample. The thinnest coating possible is best for sample damage, fine detail and sputter target lifetime.