Q300T D Plus
Key Features
- Capable of achieving vacuum of 5x10⁻⁵ mbar
- Dual sputter head dual allows sequential coating of samples, up to 150 mm Ø, with two different metals without breaking vacuum
- Touch and swipe capacitive screen
- USB port for upgrades and download of process log files
- Multiple-user profiles can be set up on one instrument
- 16GB of memory can store more than 1000 recipes
- Multi-colour LED visual status indicator
- 1 x Chromium target and 1 x Gold target as standard
- Capable of sputtering non-oxidizing and oxidizing metals e.g. Cr, Ir, W, Al, Ti, Au, Pt
Details
Suitable for multi-layer sequential sputtering of two materials, the Q300T D Plus has two independent sputtering heads, which allows sequential sputtering of two metals without the need to break vacuum. The system is fully automated with user defined recipes controlling the pumping sequence, time, number of sputter cycles, and the current used during the process. Unlimited layers of varying thickness from two target materials can be sputtered sequentially by cycling between both targets. When not in use the targets are shuttered for protection from contamination.
- Large samples e.g Silicon Wafers (up to 200 mm Ø ) or multiple small samples Wafer inspection
- Multiple sample preparation for SEM E Thin-film applications and SEM/FE-SEM
Product Information
- Dual sputter head dual target
- Large Chamber (300 mm Ø)
- Pump-down Vacuum: 5x10⁻⁵ mbar
- Chromium and Gold targets as standard
Instrument case
590 mm W x 535 mm D x 420 mm H (maximum height during the opening of the coating head: 772 mm)
Weight
36 kg (packed: 59 kg)
Packed dimensions
730 mm W x 630 mm D x 690 mm H
Work chamber
Borosilicate glass with integral PET implosion guard Size 300 mm outside diameter x 127 mm High
Display
115.5mm W x 86.4mm H (active area), 640 RGB x 480 (display format), capacitive touch colour display
User interface
Full graphical interface with touch screen buttons, includes features such as a log of the last 1000 coatings and reminders for when maintenance is due
Sputter target
Disc-style 57 mm Ø. A 0.5 mm thick chromium (Cr) and 57 mm Ø. A 0.1 mm thick Gold (Au) is fitted as standard. Pt, Pt/Pd, Pt, Au, Au/Pd, Ni, Ag, Pd, Cu, Cr, W, Al, Ti, Fe, Ir, Co, Sn, Mo, Mg, Ta and ITO target options available in various thicknesses.
Specimen stage
A flat adjustable stage capable of accepting either 4” or 6” wafers is mounted on a swinging arm stage, which rotates the stage under the targets to optimise coating. Rotation speed is variable from 14 rpm to 38 rpm
More information
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