RotaQ ES
Rotary pumped coater suitable for sputtering non-oxidising metals (Au, Au/Pd, Ag, Pt, and Pt/Pd), and carbon evaporation.
Key Features
- Recommended for low-medium magnification
- Suitable for use with Tungsten/LaB⁶ SEM and Benchtop SEM
- Sputter coater for noble metals. Au target offered as standard. Au/Pd, Ag, Pt, Pt/Pd available as options.
- Rapid cycle time for maximum sample throughput
- Tilt stage design giving uniform coating of complex 3D structures
- Film Thickness Monitor (FTM) to control deposition of coating
- Intuitive and responsive touchscreen colour panel design
- Multi-colour LED visual status indicator offering process updates
- Pre-set recipes for standard protocols resulting in sample reproducibility
- Customizable recipes for tailored applications
- Easy and quick set-up of profiles
- Multiple stage options based on application needs
Details
The RotaQ S is an automated and versatile rotary pumped coater offering unparalleled ease of use. Recommended for sample preparation for the examination of specimens using Electron Microscopy (EM). The Rotary pumped coater is suitable for use with Tungsten/LaB⁶ SEM and Benchtop SEM.
The RotaQ S is an automatic sputter coater for noble metals. Available sputtering targets include Au, Au/Pd, Pd, Ag, Pt/Pd .
Technical Information
Site requirements
Venting gas: Nitrogen supply for purging should be N4.8 (Zero Grade) 99.998% purity capable of supplying 0.5 bar (minimum 0.3 bar and maximum 1 bar) with nominal flow rate of 3 ± 0.2 litre/min for 60 s. The system is supplied with 3m plastic tubing 3 mm I.D. x 6 mm O.D. from quick release connectors to be fitted to a pressure regulator or plant supply.
Pumping gas: Argon supply for sputtering should be N4.8 (Zero Grade) 99.998% purity capable of supplying 0.5 bar (minimum 0.3 bar and maximum 1 bar) with nominal flow rate of 3 ± 0.2 litre/min for a 4-minute maximum sputter cycle time (some instruments may have specially extended sputter cycles). The system is supplied with 3m plastic tubing 3 mm I.D. x 6 mm O.D. from quick release connectors on the rear of the unit. It is the customer’s responsibility to connect from this hose to the pressure regulator set at approximately 10psi, from gas bottle or plant supply. Typically, a system will use 0.2 litres of Argon for a 4-minute sputter cycle.
Applications
- Tungsten/LaB⁶ SEM and Benchtop SEM
- Low and medium magnifications
- Noble metals Au, Au/Pd, Pd, Ag, Pt/Pd
Specifications
- Unit Weight 32 Kg (S model)
- Packed weight 46 Kg (S model)
- Instrument size 440 mm (W) x 556 mm (H) x 551 mm (D)
- Instrument size with chamber open 440 mm (W) x 860 mm (H) x 551 mm (D)
- Specimen stage Short stage 65 mm (H) from chamber base, 50 mm Ø diameter Tall stage: 145mm (H) from chamber base, 50 mm Ø diameter
- Chamber size: 150 mm Ø diameter, 220 mm (H)
- Ultimate vacuum 6x10-3 mbar
- Operational vacuum 1x10-1 mbar
- Vacuum gauge range 1013 – 1x10-4 mbar
- User interface Touch screen colour display USB connectors Back-up process log files and recipes easily achievable using a USB Sputter Coater
- Sputter target : Target Disc style, 57 mm Ø diameter x 0.1 mm (thickness). Au target supplied as standard.
- Specimen Stage 50 mm Ø diameter rotating stage
- Deposition Current 1-150 mA
- Deposition Rate 0.1-20 nm/min (e.g. for Au)
- Sputter Timer 0-60 min
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